DMP-1032 PCI/ISA Engineer Computer-configuration

How to make the SolderlessBreadboard
for I/O port 300 / 301 experiment

1. Prepare the Tools, SolderlessBreadboard and Spare parts

2. Arrange spare parts position on the SolderlessBreadboard (i.e IC).

This experiment use DMP-1032 Engineer Computer to test, therefore, the socket's position on the SolderlessBreadboard should arrange with the space and match to DMP-1032 Engineer Computer's Slot

Before start to connecting the wire to each spare parts,
here is the description for the SolderlessBreadboard and how to connecting the IC.

SolderlessBreadboard:
The SolderlessBreadboard have many holes that user can plug the spare parts PIN into the hole, on the board, the 5 holes as a set mark as ABCDE, FGHIJ..etc. in vertical direction, so the electric current will also pass from A row to E row in vertical direction, but won't pass from ABCDE set to FGHIJ set.

The + & - 5 holes as a set, electric current will pass in horizontal direction, won't pass in vertical direction from + to – also won't pass to ABCED, FGHIJ set.

How to connecting the IC PIN to PIN with the wire base on the electric current direction:
For example: Connect the IC A PIN 15 to IC B PIN 5

3. Follow the circuit diagram to connecting the PIN of each spare parts's PIN by the wire.
Usually connecting the VCC (+) and GND (-) first, then, connecting other spare parts.

4. IC connect to the socket or IC connected

Use A type resistan, they all have same circle on the left side, the circle is stand for below photo shows it's A type resistan on the circuit diagram.

5. Connecting rest of resistances, wire with switch and LED

6. Complete the SolderlessBreadboard for I/O port 300 / 301 experiment